Technical Program
Paper Detail
| Paper: | MP.L3.1 | ||
| Session: | HEVC I | ||
| Time: | 14:20 - 14:40 | ||
| Presentation: | Oral | ||
| Topic: | Image & Video Communications: COM-LOC | ||
| Title: | GENERALIZED INTER-LAYER RESIDUAL PREDICTION FOR SCALABLE EXTENSION OF HEVC | ||
| Authors: | Xiang Li; Qualcomm Technology Inc. | ||
| Jianle Chen; Qualcomm Technology Inc. | |||
| Krishna Rapaka; Qualcomm Technology Inc. | |||
| Marta Karczewicz; Qualcomm Technology Inc. | |||